16.0µm Fine Particle Spherical Silica - Semiconductor Encapsulation Material
16.0µm Fine Particle Spherical Silica - Semiconductor Encapsulation Material
SKU:FIN-6a2fb9
High-purity 16.0µm fine silica for reliable semiconductor encapsulation and coating materials.
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$49.99
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$49.99
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16.0µm Fine Particle Spherical Silica - Semiconductor Encapsulation Material
$49.99
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16.0µm Fine Particle Spherical Silica - Semiconductor Encapsulation Material
$49.99
Quantity: 1
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Our 16.0 µm D50 (Median Size) Fine Particle Spherical Silica is specially designed for high-performance encapsulation material needs. With exceptional roundness, purity, and tailored particle size distribution, this product ensures the reliability of high-density semiconductors. Its high flowability, low thermal expansion, and electrical insulation properties make it ideal for various applications in semiconductor manufacturing.
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Product Specifications
Applications
Semiconductor encapsulation material fillerCoating materialsFiller material for various kinds of resin
Characteristics
High purity (non crystal silica)High sphericity (high roundness)High flowabilityHigh filling densityLow thermal expansion ratioElectrical insulation propertyLow water absorption property
Technical Specs Chemical Compound Aluminium Oxide Al2o3
2000 ppm
Technical Specs Chemical Compound Iron Iii Oxide Fe2o2
20 ppm
Technical Specs Chemical Compound Potassium Oxide K2o
20 ppm
Technical Specs Chemical Compound Silicon Dioxide Sio2
99.8 %
Technical Specs Chemical Compound Sodium Oxide Na2o
30 ppm
Technical Specs D50 Median Size
16.0 µm
Technical Specs Electric Conductivity
2.0 µs/cm
Technical Specs Ionic Impurity Free Cl
0.1 ppm
Technical Specs Ionic Impurity Free Na
0.2 ppm
Technical Specs Potential Of Hydrogen Ph
5.5
Technical Specs Roundness
0.94
Technical Specs Specific Gravity
2.21
Technical Specs Specific Surface Area
3.4 m²/g