Dymax® Electronic Edgebond Adhesives
Dymax® Electronic Edgebond Adhesives
SKU:ELE-8715df
Cure instantly with UV light for durable PCB reinforcement. Ideal for shock attenuation and fine-pitch leads.
Regular price
$29.99
Regular price
Sale price
$29.99
Unit price
per
Delivery via Maden
Expect your order to arrive on time.
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Dymax® Electronic Edgebond Adhesives are cutting-edge solutions for rapid and durable ruggedization of PCB components. These adhesives cure instantly under UV/Visible light, ensuring shock attenuation where needed. Ideal for bonding to various materials like silicon, ceramic, lead frame, and PCB, they excel in reinforcing fine-pitch leads and leadless components, serving as a reliable alternative to underfill. With features like electrically insulating properties, low thermal stress, and high coverage, they enhance performance while minimizing handling time. Additionally, secondary heat or moisture-cure options further cater to specific application needs.
Product Specifications
Specifications Cure Depth
6.5 mm | 0.26 in
Specifications Durometer Hardness
D57
Specifications Halogen Free
Yes
Specifications Nominal Viscosity
45,000 cP
Specifications Tensile At Break
22 MPa | 3,000 psi