Fine Particle Spherical Silica - 20.0µm D50 Median Size
Fine Particle Spherical Silica - 20.0µm D50 Median Size
SKU:FIN-48feef
High-purity Fine Particle Spherical Silica with 20.0µm D50, perfect for semiconductor encapsulation and resin applications.
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$29.99
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$29.99
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Fine Particle Spherical Silica - 20.0µm D50 Median Size
$29.99
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Fine Particle Spherical Silica - 20.0µm D50 Median Size
$29.99
Quantity: 1
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Our Fine Particle Spherical Silica, with a D50 median size of 20.0µm, offers superior high purity and high sphericity essential for semiconductor encapsulation. With a specific surface area of 2.4 m²/g and exceptional roundness, this product ensures high reliability in high-density semiconductor applications. Its chemical composition of 99.8% Silicon Dioxide (SiO2) meets stringent industry requirements, while its low impurity levels and electrical insulation properties make it ideal for various resin applications.
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Product Specifications
Applications
Semiconductor encapsulation material fillerCoating materialsFiller material for various kinds of resin
Characteristics
High purity (non crystal silica)High sphericity (high roundness)High flowabilityHigh filling densityLow thermal expansion ratioElectrical insulation propertyLow water absorption property
Technical Specs Chemical Compound Aluminium Oxide Al2o3
2500 ppm
Technical Specs Chemical Compound Iron Iii Oxide Fe2o2
20 ppm
Technical Specs Chemical Compound Potassium Oxide K2o
20 ppm
Technical Specs Chemical Compound Silicon Dioxide Sio2
99.8 %
Technical Specs Chemical Compound Sodium Oxide Na2o
30 ppm
Technical Specs D50 Median Size
20.0 µm
Technical Specs Electric Conductivity
2.0 µs/cm
Technical Specs Ionic Impurity Free Cl
0.1 ppm
Technical Specs Ionic Impurity Free Na
0.2 ppm
Technical Specs Potential Of Hydrogen Ph
5.5
Technical Specs Roundness
0.96
Technical Specs Specific Gravity
2.21
Technical Specs Specific Surface Area
2.4 m²/g