High-Purity 21.0 µm Fine Particle Spherical Silica
High-Purity 21.0 µm Fine Particle Spherical Silica
SKU:FIN-fac3c6
Discover high-purity 21.0 µm silica for superior encapsulation & coating needs. High sphericity & purity. Ideal for semiconductors.
Regular price
$45.99
Regular price
Sale price
$45.99
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per
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Our High-Purity 21.0 µm Fine Particle Spherical Silica is engineered using a cutting-edge flame spray method to ensure exceptional encapsulation performance, safeguarding semiconductor reliability. With a sphericity of 0.93, high purity of 99.8% Silicon Dioxide, and tailored particle size distribution, this product offers high flowability, low thermal expansion, and superior electrical insulation. Ideal for semiconductor encapsulation, coating materials, and resin fillers, it meets stringent industry standards for quality and performance.

Product Specifications
Applications
Semiconductor encapsulation material fillerCoating materialsFiller material for various kinds of resin
Characteristics
High purity (non crystal silica)High sphericity (high roundness)High flowabilityHigh filling densityLow thermal expansion ratioElectrical insulation propertyLow water absorption property
Technical Specs Chemical Compound Aluminium Oxide Al2o3
1500 ppm
Technical Specs Chemical Compound Iron Iii Oxide Fe2o2
20 ppm
Technical Specs Chemical Compound Potassium Oxide K2o
20 ppm
Technical Specs Chemical Compound Silicon Dioxide Sio2
99.8 %
Technical Specs Chemical Compound Sodium Oxide Na2o
20 ppm
Technical Specs D50 Median Size
21.0 µm
Technical Specs Electric Conductivity
2.0 µs/cm
Technical Specs Ionic Impurity Free Cl
0.1 ppm
Technical Specs Ionic Impurity Free Na
0.2 ppm
Technical Specs Potential Of Hydrogen Ph
5.5
Technical Specs Roundness
0.93
Technical Specs Specific Gravity
2.21
Technical Specs Specific Surface Area
2.6 m²/g