High-Purity Fine Particle Spherical Silica 18.0µm D50
High-Purity Fine Particle Spherical Silica 18.0µm D50
SKU:FIN-dde490
High-purity Fine Particle Silica for precise semiconductor encapsulation and coatings with 18.0µm D50, high roundness, and 99.8% Silicon Dioxide purity.
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$49.99
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$49.99
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High-Purity Fine Particle Spherical Silica 18.0µm D50
$49.99
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High-Purity Fine Particle Spherical Silica 18.0µm D50
$49.99
Quantity: 1
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Experience exceptional quality with our High-Purity Fine Particle Spherical Silica, meticulously crafted for semiconductor encapsulation and coating materials. With a D50 median size of 18.0µm, high roundness, and purity of 99.8% Silicon Dioxide, this product ensures high reliability, low thermal expansion, and excellent electrical insulation. Ideal for high-density semiconductors, it offers superior flowability, low water absorption, and precise particle size distribution tailored to your specific requirements.
Product Specifications
Applications
Semiconductor encapsulation material fillerCoating materialsFiller material for various kinds of resin
Characteristics
High purity (non crystal silica)High sphericity (high roundness)High flowabilityHigh filling densityLow thermal expansion ratioElectrical insulation propertyLow water absorption property
Technical Specs Chemical Compound Aluminium Oxide Al2o3
2500 ppm
Technical Specs Chemical Compound Iron Iii Oxide Fe2o2
20 ppm
Technical Specs Chemical Compound Potassium Oxide K2o
20 ppm
Technical Specs Chemical Compound Silicon Dioxide Sio2
99.8 %
Technical Specs Chemical Compound Sodium Oxide Na2o
30 ppm
Technical Specs D50 Median Size
18.0 µm
Technical Specs Electric Conductivity
2.0 µs/cm
Technical Specs Ionic Impurity Free Cl
0.1 ppm
Technical Specs Ionic Impurity Free Na
0.2 ppm
Technical Specs Potential Of Hydrogen Ph
5.5
Technical Specs Roundness
0.96
Technical Specs Specific Gravity
2.21
Technical Specs Specific Surface Area
2.5 m²/g