High-Purity Spherical Silica Filler - 26.0 µm D50 Size
High-Purity Spherical Silica Filler - 26.0 µm D50 Size
SKU:FIN-04426d
High-purity spherical silica filler for semiconductor encapsulation and coatings.
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$39.99
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$39.99
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High-Purity Spherical Silica Filler - 26.0 µm D50 Size
$39.99
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High-Purity Spherical Silica Filler - 26.0 µm D50 Size
$39.99
Quantity: 1
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Our High-Purity Spherical Silica Filler, with a median size of 26.0 µm, is crafted using an innovative flame spray method to ensure exceptional sphericity and purity. With a specific surface area of 2.2 m²/g and high roundness, this product guarantees reliable encapsulation for high-density semiconductors. Enjoy high flowability, low thermal expansion, and electrical insulation properties, making it ideal for various industrial applications.
Product Specifications
Applications
Semiconductor encapsulation material fillerCoating materialsFiller material for various kinds of resin
Characteristics
High purity (non crystal silica)High sphericity (high roundness)High flowabilityHigh filling densityLow thermal expansion ratioElectrical insulation propertyLow water absorption property
Technical Specs Chemical Compound Aluminium Oxide Al2o3
500 ppm
Technical Specs Chemical Compound Iron Iii Oxide Fe2o2
20 ppm
Technical Specs Chemical Compound Potassium Oxide K2o
20 ppm
Technical Specs Chemical Compound Silicon Dioxide Sio2
99.9 %
Technical Specs Chemical Compound Sodium Oxide Na2o
20 ppm
Technical Specs D50 Median Size
26.0 µm
Technical Specs Electric Conductivity
2.0 µs/cm
Technical Specs Ionic Impurity Free Cl
0.1 ppm
Technical Specs Ionic Impurity Free Na
0.2 ppm
Technical Specs Potential Of Hydrogen Ph
5.5
Technical Specs Roundness
0.94
Technical Specs Specific Gravity
2.21
Technical Specs Specific Surface Area
2.2 m²/g