IXEPLAS® 500nm Diameter Inorganic Ion Capture Agent
IXEPLAS® 500nm Diameter Inorganic Ion Capture Agent
SKU:FUN-5a405f
Experience superior ion capture with IXEPLAS® 500nm Diameter Inorganic Agent, offering high heat resistance and exceptional reliability in semiconductor packages.
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$49.99
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IXEPLAS® 500nm Diameter Inorganic Ion Capture Agent
$49.99
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IXEPLAS® 500nm Diameter Inorganic Ion Capture Agent
$49.99
Quantity: 1
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IXEPLAS® 500nm Diameter Inorganic Ion Capture Agent is a cutting-edge solution crafted for high-performance ion capture in semiconductor packages and IC sealants. With exceptional ion-capturing capabilities and heat resistance up to ~300°C, this product ensures enhanced reliability and protection against ionic impurities. Featuring submicron-sized primary particles of aluminum, magnesium, and zirconium, it effectively traps copper, silver, and sodium ions, making it ideal for a wide range of applications including corrosion control, migration inhibition, and encapsulant IC uses. IXEPLAS® is designed for optimal performance in demanding environments while maintaining high purity and minimal impurities, ensuring superior results.
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Product Specifications
Action Mechanism Action Mechanism
Since IXEPLAS® catches ionic impurities in IC packages, the electronic materials are protected by the attacks of the impurities and their sustainability improve.
Applications Applications
Image of ion trapping of IXEPLAS®Migration inhibition of copper wiringCorrosion control of aluminum wiring
Features Features
The size of the primary particles of IXEPLAS® is submicron order and you can apply it to underfill materials, narrow pitch IC packages, etc.Because of its small particle size, it shows high effect with addition of only a little amount.It traps copper and silver ions and is the most suitable for additives to sealants of copper bonding wire and silver wiring.It shows ion-capturing capacity in wide pH range because it can exchange both anions and cations.Because it hardly contains impurities, it does not have negative effects for the sealants.
General Characteristics Diameter
500 nm
General Characteristics Heat Resistance
~ 300 ºC
General Characteristics Ingredients
Aluminum (Al) | Magnesium (Mg) | Zirconium (Zr)
General Characteristics Ingredients Features
Both Ion Exchange.Particulate Standard Grade.
General Characteristics Ion Species That Would Be Captured
Copper (Cu2+) | Silver (Ag+) | Sodium (Na+)
Handling Precautions Handling Precautions
Since the product is fine powder, when hamdling, avoid breathing vapor, wear suitable protective clothing, gloves andIF in Eyes: Rinse cautiously with water for several minutes. Get medical attention.IF on Skin: Wash with plenty of soap and water.In each application, please investigate laws and regulations related to the product.
Note Note
When you store, use or dispose of the product, refer to the Safety Data Sheet issued by our company, or consult our company's representative.What is described herein, is based on the experiments conducted with extreme caution, so it does not guarantee the results of practical use. In addition, with respect to performance, such as patent as a final product from the use of this product cannot be held responsible.
Purpose Purpose
Encapsulant IC (EMC, Liquid encapsulants, Underfill materials, Die bonding film)Adhesive for FPCSolar cell components (Back sheet, The sealing resin)Resist ink, etc.
The Ion Capturing Effect The Ion Capturing Effect
IXEPLAS® catches ionic impurities contained in IC sealants if added to them.Once IXEPLAS® traps ions, it hardly releases them.