17.0 Micrometers D50 Fine Particle Spherical Silica

Name: 17.0 Micrometers D50 Fine Particle Spherical Silica
Brand: Sanyo Corporation of America
SKU: FIN-cc466b
Price: 29.99 USD
Availability: OutOfStock

SKU:FIN-cc466b

High-purity 17.0 µm Fine Particle Silica for reliable semiconductor encapsulation and coating materials.

$29.99

Sale

Quantity

Delivery via Maden

Expect your order to arrive on time.

Secure Payments

All orders are processed through a secure, PCI-compliant checkout.

View full details

Our 17.0 µm D50 (Median Size) Fine Particle Spherical Silica is a pioneering ceramic encapsulation material. With exceptional purity and sphericity, it safeguards the reliability of high-density semiconductors. Tailored to meet specific requirements, it offers high flowability, low thermal expansion, and superior electrical insulation. Ideal for semiconductor encapsulation, coatings, and resin fillers, it ensures high performance and consistent quality.

Product Specifications

Applications

Semiconductor encapsulation material fillerCoating materialsFiller material for various kinds of resin

Characteristics

High purity (non crystal silica)High sphericity (high roundness)High flowabilityHigh filling densityLow thermal expansion ratioElectrical insulation propertyLow water absorption property

Technical Specs Chemical Compound Aluminium Oxide Al2o3

500 ppm

Technical Specs Chemical Compound Iron Iii Oxide Fe2o2

20 ppm

Technical Specs Chemical Compound Potassium Oxide K2o

20 ppm

Technical Specs Chemical Compound Silicon Dioxide Sio2

99.9 %

Technical Specs Chemical Compound Sodium Oxide Na2o

20 ppm

Technical Specs D50 Median Size

17.0 µm

Technical Specs Electric Conductivity

2.0 µs/cm

Technical Specs Ionic Impurity Free Cl

0.1 ppm

Technical Specs Ionic Impurity Free Na

0.3 ppm

Technical Specs Potential Of Hydrogen Ph

5.5

Technical Specs Roundness

0.97

Technical Specs Specific Gravity

2.21

Technical Specs Specific Surface Area

1.0 m²/g

17.0 Micrometers D50 Fine Particle Spherical Silica