18.4 MPa Modulus of Elasticity Electronic Encapsulant
18.4 MPa Modulus of Elasticity Electronic Encapsulant
SKU:ELE-ff1d47
Protect PCB components with our 18.4 MPa Modulus of Elasticity Electronic Encapsulant - rapid curing, low stress, high purity.
Regular price
$29.99
Regular price
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$29.99
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18.4 MPa Modulus of Elasticity Electronic Encapsulant
$29.99
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18.4 MPa Modulus of Elasticity Electronic Encapsulant
$29.99
Quantity: 1
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Safeguard your printed circuit board components with our 18.4 MPa Modulus of Elasticity Electronic Encapsulant. This encapsulant offers rapid tack-free curing upon exposure to UV/Visible/LED light, ensuring complete protection and low stress under thermal cycling. Featuring secondary heat or moisture-cure options, it meets the demands of various PCB applications with high ionic purity and electrically insulating properties. Simplify your production process, increase throughput, and enhance reliability with this encapsulant.
Product Specifications
Additional Key Features 0
100% no solvents addedLow stress under thermal cyclingInstant UV/Visible curesElectrically insulatingHigh ionic purityRoom-temperature storageTenacious adhesion to flex circuit substrates (polyimide and PET)Thermal shock and moisture resistance
Applications 0
Chip-on-boardChip-on-flexChip-on-glassWire bonding
Cured Mechanical Properties Durometer Hardness
D30-D50
Cured Mechanical Properties Elongation At Break
34 %
Cured Mechanical Properties Modulus Of Elasticity
18.4 MPa | 2,670 psi
Specifications Halogen Free
Yes
Uncured Properties Nominal Viscosity
17,000 cP