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200mm Bare Machined Aluminum Platen Heater

200mm Bare Machined Aluminum Platen Heater

SKU:200-14c197

Cost-effective and high-performance 200mm aluminum platen heater for semiconductor processing, featuring ±0.3% surface temperature uniformity.

Regular price $1,899.99
Regular price Sale price $1,899.99
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200mm Bare Machined Aluminum Platen Heater

200mm Bare Machined Aluminum Platen Heater

$1,899.99

Quantity: 1

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200mm Bare Machined Aluminum Platen Heater

200mm Bare Machined Aluminum Platen Heater

$1,899.99

Quantity: 1

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The 200mm Bare Machined Aluminum Platen Heater offers cost-effective solutions for semiconductor processing and research. Made of durable Aluminum Alloy 356, this heater provides world-class performance with operating temperatures up to 752°F. With ±0.3% surface temperature uniformity, it ensures accuracy in wafer processing. Ideal for prototype trials, it features a perfect circle diameter of 82.55mm and a surface flatness of <0.0005in. Ready for quick installation, this heater guarantees long product life and efficient performance.

Product Specifications

Additional Information 0
This platen heater design is ideal for prototype machine trials or engineering experiments as well as temporary repairs until custom heaters can be manufactured. CAS platen heaters provide a complete turnkey solution and are available in anodized finish, or in bare machined aluminum 356 with optional add-on features. The stock anodized cast aluminum platen heaters are complete, ready to install parts and are available for shipment within one business day.Part is ultrasonic washed followed by IPA wipe down prior to packaging.
Applications 0
Semiconductor processing.Semiconductor research and development.
Features And Benefits 0
Stock deliveryAssures a cost effective option for 200 and 300 mm wafer processing.World class performance"Cast-in" reliability assures long product life.Operating temperatures up to 752 ºF (400 ºC) for a wide range of process applications.Surface temperature uniformity of ±0.3% of set point assures wafer processing accuracy.
Specifications Angle
120 º
Specifications Cleaning
Ultrasonic wash followed by IPA wipe down
Specifications Delivery Time
4 to 6 weeks
Specifications Diameter
9 in | 228.6 mm
Specifications Heater Power At 208 V
1681 W
Specifications Heater Power At 240 V
2241 W
Specifications Heater Shape
Platen
Specifications Lift Pin Hole Diameter
0.125 in | 3.2 mm
Specifications Material
Aluminum Alloy 356
Specifications Maximum Power
2241 W
Specifications Maximum Voltage
240 V
Specifications Number Of Lift Pin Hole
3X
Specifications Number Of Thermocouple Hole
1X
Specifications Perfect Circle Diameter
3.25 in | 82.55 mm
Specifications Surface Flatness
< 0.0005 in | 0.013 mm
Specifications Surface Temperature Uniformity
±0.3% of set point based on measurements at laboratory ambient conditions
Specifications Thermocouple Hole Diameter
0.066 in | 1.68 mm
Specifications Thermocouple Type
No Thermocouple Included
Specifications Thickness
1.25 in | 31.75 mm
Specifications Power
1681 W
Specifications Voltage
208 V