6.2 MPa Modulus of Elasticity Electronic Encapsulant
6.2 MPa Modulus of Elasticity Electronic Encapsulant
SKU:ELE-50bbca
Advanced electronic encapsulant with UV/Visible light cure, halogen-free, and high mechanical properties. ASTM compliant.
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6.2 MPa Modulus of Elasticity Electronic Encapsulant
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6.2 MPa Modulus of Elasticity Electronic Encapsulant
$29.99
Quantity: 1
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The 6.2 MPa Modulus of Elasticity Electronic Encapsulant by Dymax® offers advanced protection for printed circuit board components with its UV/Visible/LED light curing capability. This halogen-free encapsulant provides low stress under thermal cycling, featuring secondary heat or moisture-cure formulations for shadow areas on PCBAs. With high mechanical properties like D40 Durometer Hardness and 900 psi Modulus of Elasticity, this encapsulant ensures durability and reliability in various applications. Compliant with ASTM standards, this product enhances throughput with fast curing and simplifies dispense, making it ideal for both consumer and institutional buyers.
Product Specifications
Additional Information 0
When cured with Dymax® light-curing spot lamps, focused-beam lamps, or flood lamps, they deliver optimum speed and performance for device assembly. Dymax® lamps offer the ideal balance of UV and visible light for the fastest, deepest cures.
Applications 0
Chip on BoardChip on FlexChip on GlassWire Bonding
Cured Mechanical Properties Coefficient Of Thermal Expansion Cte
171 µm/m/ºC
Cured Mechanical Properties Durometer Hardness
D40
Cured Mechanical Properties Elongation At Break
110 %
Cured Mechanical Properties Glass Transition Temperature Tg
31 ºC
Cured Mechanical Properties Modulus Of Elasticity
6.2 MPa | 900 psi
Cured Mechanical Properties Tensile At Break
5.8 MPa | 850 psi
Cured Mechanical Properties Test Method For Coefficient Of Therm
American Society for Testing and Materials (ASTM E831)
Cured Mechanical Properties Test Method For Durometer Hardness
American Society for Testing and Materials (ASTM D2240)
Cured Mechanical Properties Test Method For Elongation At Break
American Society for Testing and Materials (ASTM D638)
Cured Mechanical Properties Test Method For Glass Transition Tem
American Society for Testing and Materials (ASTM D5418)
Cured Mechanical Properties Test Method For Modulus Of Elasticit
American Society for Testing and Materials (ASTM D638)
Cured Mechanical Properties Test Method For Tensile At Break
American Society for Testing and Materials (ASTM D638)
Electrical Properties Dielectric Breakdown Voltage
900 V/mil
Electrical Properties Dielectric Constant At 1 Megahertz Mhz Fre
4.31
Electrical Properties Dissipation Factor At 1 Megahertz Mhz Freq
0.03
Electrical Properties Surface Resistivity
9.44E+10 O
Electrical Properties Test Method For Dielectric Breakdown Volta
American Society for Testing and Materials (ASTM D149)
Electrical Properties Test Method For Dielectric Constant At 1 M
American Society for Testing and Materials (ASTM D150)
Electrical Properties Test Method For Dissipation Factor At 1 Me
American Society for Testing and Materials (ASTM D150)
Electrical Properties Test Method For Surface Resistivity
American Society for Testing and Materials (ASTM D257)
Electrical Properties Test Method For Volume Resistivity
American Society for Testing and Materials (ASTM D257)
Electrical Properties Volume Resistivity
2.59E+10 O·cm
Features 0
UV/Visible Light CureSecondary Heat CureFlexible EncapsulantShadow Area PerformanceMoisture and Thermal ResistanceBlue Fluorescing
Other Cured Properties Boiling Water Absorption 2 Hours H
2.0 %
Other Cured Properties Linear Shrinkage
2.2 %
Other Cured Properties Refractive Index At 20 Degree Celsius C T
1.50
Other Cured Properties Test Method For Boiling Water Absorption
American Society for Testing and Materials (ASTM D570)
Other Cured Properties Test Method For Linear Shrinkage
American Society for Testing and Materials (ASTM D2566)
Other Cured Properties Test Method For Refractive Index At 20 De
American Society for Testing and Materials (ASTM D542)
Other Cured Properties Test Method For Water Absorption 25 Degre
American Society for Testing and Materials (ASTM D570)
Other Cured Properties Water Absorption 25 Degree Celsius C Temp
0.9 %
Recommended Adhesives Recommended Adhesives
Aluminum (AL) (Limited Applications) | Flame Retardant (FR-4) | Printed Circuit Board (PCB)
Recommended Curing Equipment 0
Spot LampLED Curing - BlueWave® MX-150Wavelength (PrimeCure®) - 385 nmBroad Spectrum - BlueWave® 200Flood LampLED Curing - BlueWave® AX-550Wavelength (PrimeCure®) - 385 nmBroad Spectrum - 5000-ECEConveyorLED Curing - UVCS Conveyor with LED FloodsBroad Spectrum - UVCS Conveyor
Recommended Dispense Equipment Recommended Dispense Equipment
Application - Dots/BeadsManual - SD-100Semi-Automated - Model 400 ValveFully Automated - eco-PEN450
Uncured Properties Shelf Life At Room Temperature Rt 22 To 25 De
12 months