9.5µm Fine Particle Spherical Silica for Semiconductor Encapsulation

Name: 9.5µm Fine Particle Spherical Silica for Semiconductor Encapsulation
Brand: Sanyo Corporation of America
SKU: FIN-7598ca
Price: 69.99 USD
Availability: OutOfStock

SKU:FIN-7598ca

High-purity 9.5µm D50 Spherical Silica for Semiconductors. Enhance reliability and performance.

$69.99

Sale

Quantity

Delivery via Maden

Expect your order to arrive on time.

Secure Payments

All orders are processed through a secure, PCI-compliant checkout.

View full details

Experience unparalleled semiconductor protection with our 9.5µm D50 Fine Particle Spherical Silica. Crafted with 99.9% Silicon Dioxide, high roundness, and exceptional purity, it ensures high flowability and low thermal expansion. Ideal for semiconductor encapsulation, coating materials, and resin fillers, it offers reliability and performance for high-density applications.

Product Specifications

Applications

Semiconductor encapsulation material fillerCoating materialsFiller material for various kinds of resin

Characteristics

High purity (non crystal silica)High sphericity (high roundness)High flowabilityHigh filling densityLow thermal expansion ratioElectrical insulation propertyLow water absorption property

Technical Specs Chemical Compound Aluminium Oxide Al2o3

500 ppm

Technical Specs Chemical Compound Iron Iii Oxide Fe2o2

50 ppm

Technical Specs Chemical Compound Potassium Oxide K2o

50 ppm

Technical Specs Chemical Compound Silicon Dioxide Sio2

99.9 %

Technical Specs Chemical Compound Sodium Oxide Na2o

50 ppm

Technical Specs D50 Median Size

9.5 µm

Technical Specs Electric Conductivity

2.5 µs/cm

Technical Specs Ionic Impurity Free Cl

0.2 ppm

Technical Specs Ionic Impurity Free Na

0.2 ppm

Technical Specs Potential Of Hydrogen Ph

5.3

Technical Specs Roundness

0.95

Technical Specs Specific Gravity

2.21

Technical Specs Specific Surface Area

2.3 m²/g

9.5µm Fine Particle Spherical Silica for Semiconductor Encapsulation