9.5µm Spherical Silica Filler
9.5µm Spherical Silica Filler
SKU:FIN-efd13f
High-purity 9.5µm Spherical Silica Filler for reliable semiconductor encapsulation and coating materials.
Regular price
$49.99
Regular price
Sale price
$49.99
Unit price
per
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Our 9.5µm D50 (Median Size) Spherical Silica Filler is a high-purity encapsulation material that ensures semiconductor reliability. With 99.9% Silicon Dioxide content and low impurity levels, it meets stringent industry standards. Its high flowability and low thermal expansion make it ideal for various applications, including semiconductor encapsulation and coating materials. Tailored to customer needs, this non-crystal silica product with superior roundness and electrical insulation properties is a top choice for high-density semiconductor devices.
Product Specifications
Applications
Semiconductor encapsulation material fillerCoating materialsFiller material for various kinds of resin
Characteristics
High purity (non crystal silica)High sphericity (high roundness)High flowabilityHigh filling densityLow thermal expansion ratioElectrical insulation propertyLow water absorption property
Technical Specs Chemical Compound Aluminium Oxide Al2o3
500 ppm
Technical Specs Chemical Compound Iron Iii Oxide Fe2o2
20 ppm
Technical Specs Chemical Compound Potassium Oxide K2o
20 ppm
Technical Specs Chemical Compound Silicon Dioxide Sio2
99.9 %
Technical Specs Chemical Compound Sodium Oxide Na2o
20 ppm
Technical Specs D50 Median Size
9.5 µm
Technical Specs Electric Conductivity
2.0 µs/cm
Technical Specs Ionic Impurity Free Cl
0.1 ppm
Technical Specs Ionic Impurity Free Na
0.1 ppm
Technical Specs Potential Of Hydrogen Ph
5.5
Technical Specs Roundness
0.98
Technical Specs Specific Gravity
2.21
Technical Specs Specific Surface Area
3.5 m²/g