9200-W Consumer Wearable Adhesive
9200-W Consumer Wearable Adhesive
SKU:CON-a6e665
Cutting-edge adhesive for consumer wearables with excellent bonding, flexibility, and skin-friendly formulation.
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$39.99
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$39.99
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9200-W Consumer Wearable Adhesive
$39.99
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9200-W Consumer Wearable Adhesive
$39.99
Quantity: 1
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The 9200-W Consumer Wearable Adhesive is a cutting-edge electronic encapsulant designed for assembly in consumer wearable devices. With a nominal viscosity of 29,000 cP and cured elongation at break of 28.2%, this adhesive is ideal for applications requiring skin proximity and sensitivity consideration. Formulated without IBOA, a known skin sensitizer, it offers excellent bonding, flexibility, and weather resistance. Whether for lens alignment, structural bonding, or component encapsulation in AR/VR headsets, earbuds, and wearable devices, this adhesive ensures reliability and safety. UV/LED curable, one-part formulation, and compliant with industry standards, it's the go-to choice for consumer wearables.
Product Specifications
Additional Information Additional Information
Dual-Cure Electronic EncapsulantDual-cure 9210-W electronic encapsulant is designed for FPC reinforcement, selective coating, and component encapsulation applications in consumer wearable devices.The product cures with light energy first and then ambient moisture for parts where shadow areas are present. 9210-W is IBOA-free and formulated with low-sensitizing ingredients to make it as safe as possible when wearables are touching or near the skin.The electronic encapsulation material exhibits great performance in reliability testing and bonds well to typical electronic substrates, including polyimide, polyamide, and FR4.9210-W dual-cure encapsulant is in full complianceFor medical wearable device assembly, see the Dymax® 2000-MW series of biocompatible IBOA- and TPO-free adhesives.
Features Features
Free of IBOA (isobornyl acrylate), a known skin sensitizerUV Broad spectrum light curableUV LED curable (365 nm or 405 nm)Secondary ambient moisture cure for shadow area curingOne-part formulation - no mixingNo solvents added
Specifications Cured Durometer Hardness
D55 to D75
Specifications Cured Elongation At Break
28.2 %
Specifications Cured Linear Shrinkage
0.85 %
Specifications Nominal Viscosity
29,000 cP
Specifications Recommended Substrates
Flame Retardant (FR-4) | Polymide (PI) | Reliable Pretreatment of Polyamide (PA)
Specifications Uncured Appearance
Colorless