Accumet Engineering 550K Epoxy Pre-Form
Accumet Engineering 550K Epoxy Pre-Form
SKU:PRE-36a411
High-performance epoxy pre-form for microelectronic packaging with exceptional adhesion strength and thermal conductivity.
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$59.99
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$59.99
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Accumet Engineering 550K Epoxy Pre-Form
$59.99
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Accumet Engineering 550K Epoxy Pre-Form
$59.99
Quantity: 1
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The Accumet Engineering 550K Epoxy Pre-Form is a high-performance adhesive film specially formulated for substrate attachment and sealing microelectronic packages. Combining exceptional adhesion strength with superior thermal conductivity in a fiberglass supported film adhesive, this product is designed to meet the demanding requirements of industrial and electronic applications. With a cure schedule of just 30 minutes at 150ºC, these frozen epoxy pre-forms from Accumet Engineering offer excellent electrical and thermal conductivity, low squeeze-out during bonding, and precise tolerances for reliable performance. Accurately laser-cut and drilled at Accumet's service centers in Westford, MA and Hudson, MA, these pre-forms are ready for immediate use, from prototyping to full production runs, ensuring optimal performance every time.
Product Specifications
Additional Information Additional Information
The 5025E series has excellent electrical and thermal conductivity, is electrically conductive in x, y, z axes, and exhibits very low squeeze-out during bonding. The typical cure schedule is only 30 minutes at 150ºC.Accumet's frozen epoxy pre-forms can be professionally supplied to be ready to use, as we are experts in laser cutting and drilling all materials to incredibly tight tolerances. All of our frozen epoxy pre-forms are stocked and supplied from one or both of our service centers in Westford, MA and Hudson, MA. We ship throughout the US, and we will work with you hands-on from prototyping to full production runs, to ensure you get the most optimally prepared pre-form - every time.
Features Features
Thermally ConductiveGood Electrical Properties
Technical Specs Brands
Accumet Engineering
Technical Specs Heat Curing At 150 Degree Celsius C Temperature
1/2 h
Technical Specs Note For Shelf Life Sl At 50 Percent Fro
Maintained at -40°C
Technical Specs Shelf Life Sl At 50 Percent From Noted
1 y
Technical Specs Thermal Conductivity
121 ºC | 8 W/m·K
Technical Specs Thicknesses Available
0.006