Advanced UV/Visible Curing Electronic Encapsulant

Name: Advanced UV/Visible Curing Electronic Encapsulant
Brand: Dymax Corp.
SKU: ELE-496bd3
Price: 29.99 USD
Availability: OutOfStock

SKU:ELE-496bd3

Cutting-edge UV/Visible curing encapsulant with low-stress thermal protection and high ionic purity for diverse PCB applications.

$29.99

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The 17.6 Megapascal (MPa) Modulus of Elasticity Electronic Encapsulant is a cutting-edge solution for protecting printed circuit board components and circuitry. Featuring quick tack-free curing upon UV/Visible/LED light exposure, this encapsulant offers secondary heat or moisture-cure capabilities for shadow areas on PCBAs. With a modulus of elasticity at 17.6 MPa, it provides low-stress protection during thermal cycling. Designed for various applications like chip-on-board, chip-on-flex, and wire bonding, this encapsulant ensures high ionic purity, thermal shock, and moisture resistance. Its halogen-free, solvent-free formulation meets stringent industry requirements, providing tenacious adhesion to flex circuit substrates and electrically insulating properties.

Product Specifications

Additional Key Features 0

100% no solvents addedLow stress under thermal cyclingInstant UV/Visible curesElectrically insulatingHigh ionic purityRoom-temperature storageTenacious adhesion to flex circuit substrates (polyimide and PET)Thermal shock and moisture resistance

Applications 0

Chip-on-boardChip-on-flexChip-on-glassWire bonding

Cured Mechanical Properties Durometer Hardness

D30-D50

Cured Mechanical Properties Elongation At Break

36 %

Cured Mechanical Properties Modulus Of Elasticity

17.6 MPa | 2,560 psi

Specifications Halogen Free

Yes

Uncured Properties Nominal Viscosity

25,000 cP

Advanced UV/Visible Curing Electronic Encapsulant