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Anodized Platen Heater - 300mm, Aluminum Alloy 356

Anodized Platen Heater - 300mm, Aluminum Alloy 356

SKU:200-63e677

Reliable 300mm Anodized Platen Heater for semiconductor processing. Precise temperature control, compliant with MIL-A-8525.

Regular price $899.99
Regular price Sale price $899.99
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Anodized Platen Heater - 300mm, Aluminum Alloy 356

Anodized Platen Heater - 300mm, Aluminum Alloy 356

$899.99

Quantity: 1

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Anodized Platen Heater - 300mm, Aluminum Alloy 356

Anodized Platen Heater - 300mm, Aluminum Alloy 356

$899.99

Quantity: 1

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The 300 Millimeter Anodized Platen Heater is a reliable solution for semiconductor processing and research. With a diameter of 13.78 inches and a power of 3350W at 208V, this aluminum heater offers precise temperature control and uniformity. Featuring an industry-standard hard anodized finish and compliance with MIL-A-8525, Type III, Class 1, this heater ensures long-term performance. Ideal for 200 and 300mm wafer processing, it guarantees ±0.3% surface temperature uniformity for accurate processing.

Product Specifications

Additional Information 0
This platen heater design is ideal for prototype machine trials or engineering experiments as well as temporary repairs until custom heaters can be manufactured. CAS platen heaters provide a complete turnkey solution and are available in anodized finish, or in bare machined aluminum 356 with optional add-on features. The stock anodized cast aluminum platen heaters are complete, ready to install parts and are available for shipment within one business day.Part is ultrasonic washed followed by IPA wipe down prior to packaging.
Applications 0
Semiconductor processing.Semiconductor research and development.
Features And Benefits 0
Stock deliveryWR300-2A ship within one business day to reduce down time.Assures a cost effective option for 200 and 300 mm wafer processing.World class performance"Cast-in" reliability assures long product life.Operating temperatures up to 752 ºF (400 ºC) for a wide range of process applications.Surface temperature uniformity of ±0.3% of set point assures wafer processing accuracy.
Specifications Angle
120 º
Specifications Cleaning
Ultrasonic wash followed by IPA wipe down
Specifications Delivery Time
6 to 8 weeks
Specifications Diameter
13.78 in | 350 mm
Specifications Hard Anodize Thickness
0.002 in | 0.05 mm
Specifications Heater Power At 208 V
3350 W
Specifications Heater Shape
Platen
Specifications Industry Standards
MIL-A-8525, Type III, Class 1
Specifications Lift Pin Hole Diameter
0.125 in | 3.2 mm
Specifications Material
Aluminum Alloy 356
Specifications Number Of Lift Pin Hole
3X
Specifications Number Of Thermocouple Hole
1X
Specifications Perfect Circle Diameter
10 in | 254 mm
Specifications Surface Flatness
< 0.0005 in | 0.013 mm
Specifications Surface Temperature Uniformity
±0.3% of set point based on measurements at laboratory ambient conditions
Specifications Thermocouple Hole Diameter
0.128 in | 3.25 mm
Specifications Thermocouple Type
No Thermocouple Included
Specifications Thickness
1.575 in | 40 mm
Specifications Power
3350 W
Specifications Voltage
208 V