Dymax 45MPa Modulus of Elasticity Electronic Encapsulant

Name: Dymax 45MPa Modulus of Elasticity Electronic Encapsulant
Brand: Dymax Corp.
SKU: ELE-a13246
Price: 24.99 USD
Availability: OutOfStock

SKU:ELE-a13246

Protect and insulate circuit components with Dymax 45MPa Modulus of Elasticity Electronic Encapsulant for rapid, secure curing under UV light.

$24.99

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The Dymax 45MPa Modulus of Elasticity Electronic Encapsulant is a cutting-edge solution for protecting printed circuit board components and circuitry. This encapsulant cures rapidly under UV/Visible/LED light, providing a tack-free finish in seconds. With secondary heat or moisture-cure options for shadow areas on PCBAs, it ensures complete coverage and protection. Its low stress under thermal cycling, high ionic purity, and electrically insulating properties make it ideal for a wide range of applications. Additionally, it offers tenacious adhesion to flex circuit substrates and impressive thermal shock and moisture resistance, ensuring durability and reliability in demanding environments.

Product Specifications

Additional Key Features 0

100% no solvents addedLow stress under thermal cyclingInstant UV/Visible curesElectrically insulatingHigh ionic purityRoom-temperature storageTenacious adhesion to flex circuit substrates (polyimide and PET)Thermal shock and moisture resistance

Applications 0

Chip-on-flexFlex circuit bonding and attachment to PCB and glass

Cured Mechanical Properties Durometer Hardness

A85

Cured Mechanical Properties Elongation At Break

300 %

Cured Mechanical Properties Modulus Of Elasticity

45 MPa | 6,500 psi

Specifications Halogen Free

Yes

Uncured Properties Nominal Viscosity

4,500 cP

Dymax 45MPa Modulus of Elasticity Electronic Encapsulant