Dymax 9801 Camera Module Adhesive
Dymax 9801 Camera Module Adhesive
High-performance camera module adhesive for rapid UV/Visible or LED light curing with heat-cure capability and superior adhesion properties.
Regular price
$39.99
Regular price
Sale price
$39.99
Unit price
per
Delivery via Maden
Expect your order to arrive on time.
Secure Payments
All orders are processed through a secure, PCI-compliant checkout.

The Dymax 9801 Camera Module Adhesive is a high-performance solution designed for rapid curing with UV/Visible or LED light, featuring secondary heat-cure capability for shadow areas. Its low shrinkage, moisture- and thermal-cycle resistance make it ideal for various camera module applications in ADAS and LiDAR assembly. Meeting ASTM E595 Outgassing standards, this adhesive offers low CTE, high Tg, very low volumetric shrinkage, and superior adhesion properties, ensuring reliable bonding on substrates like PPS, FR-4, LCP, PCB, CAP, PS, and glass. With fast curing, moisture resistance, low temperature heat cure, and cold storage capabilities, the Dymax 9801 is a top choice for active alignment applications.
Product Specifications
Additional Information Additional Information
Low Shrinkage Camera Module Adhesive with LED and Heat-Cure CapabilityDymax® 9801 is a LED or UV/Visible light-curable material with superior adhesion properties for bonding camera modules, lidar, active alignment applications. The adhesive is moisture and thermal cycle resistant and meets the stringent low-shrinkage requirements introduced for active alignment applications in Advanced Driver Assistance Systems (ADAS). 9801 cures with UV light but also features heat-cure capability for applications where shadowed areas exist. This one-component product bonds rapidly and is recommended for surfaces and substrates including LCP, PCB, PPS, FPC, CAP, PS, FR-4 board, and glass.9801 requires cold storage/cold shipping and should be kept between 1ºC (34ºF) and 5ºC (41ºF) in the original, unopened container.Dymax® materials contain no nonreactive solvents and cure upon exposure to light. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax® UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax® lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.
Features Features
Fast cure with LED or UV/Visible lightLow temperature heat cure (80-85ºC)Moisture resistantThermal cycle resistantSingle componentCold ship/Cold storage at 1-5ºCPasses ASTM E595 Outgassing Testing
Specifications Industry Standards
American Society for Testing and Materials (ASTM) E595
Specifications Nominal Viscosity
60,000 cP
Specifications Recommended Substrates
Cellulose Acetate Propionate (CAP) | Flame Retardant (FR-4) | Glass | Polystyrene (PS)
Specifications Recommended Surfaces
Flexible Printed Circuit (FPC) | Liquid Crystal Polymer (LCP) | Polyphenylene Sulfide (PPS) | Printed Circuit Boards (PCB)
Specifications Uncured Appearance
Off White Opaque to Charcoal Translucent Gel
Specifications Volumetric Shrinkage
1.5 %