Dymax 9803 Optical Camera Module Adhesive
Dymax 9803 Optical Camera Module Adhesive
Rapid-curing optical adhesive with low shrinkage & high adhesion for camera modules. Meets ASTM E595 standards.
Regular price
$29.99
Regular price
Sale price
$29.99
Unit price
per
Initiate Order
Dymax 9803 Optical Camera Module Adhesive
$29.99
Quantity: 1
Claim Your Seller Account
Dymax 9803 Optical Camera Module Adhesive
$29.99
Quantity: 1
Delivery via Maden
Expect your order to arrive on time.
Secure Payments
All orders are processed through a secure, PCI-compliant checkout.
The Dymax 9803 Optical Camera Module Adhesive is a rapid-curing epoxy designed for camera module applications in ADAS and LiDAR assembly. With a nominal viscosity of 86,000 cP, this adhesive offers very low volumetric shrinkage, high Tg, and low CTE properties, making it ideal for active alignment and optical bonding. It meets ASTM E595 standards for low outgassing, ensuring reliability in critical optical positioning applications. With the ability to cure with LED/UV light or heat, this adhesive provides superior adhesion on substrates like ABS, FR-4, LCP, and more.
Product Specifications
Additional Information Additional Information
Low Shrinkage Optical Camera Module Adhesive with LED and/or Heat-CureDymax® 9803 low shrinkage optical epoxy adhesive offers superior adhesion for common substrates used in camera modules and LiDAR assemblies, in active alignment, and other optical bonding applications. The adhesive has the unique flexibility to cure in seconds with LED and/or UV/Visible light as well as low temperature heat for shadow areas.In addition, 9803 meets critical low-outgassing specifications making it ideal for complex optical positioning applications such as lens bonding, bonding the lens barrel to holder or bonding the holder to printed circuit boards (PCBs).The one component epoxy requires cold shipment and cold storage (and should be kept between 1 ºC (34 ºF) and 5 ºC (41 ºF) but does not require frozen shipment or storage conditions. The epoxy has improved 85 ºC/85% RH resistance, exhibits less overall movement through thermal excursions and features higher viscosity and thixotropy to maintain bead shape upon dispense.
Features Features
Rapid LED or UV/Visible light and/or heat cureVery low volumetric shrinkageHigh Tg and Low CTELow ASTM E595 OutgassingNo frozen storage, refrigerated shipment/storage 1-5 ºC [34-41 ºF]
Specifications Industry Standards
American Society for Testing and Materials (ASTM) E595
Specifications Nominal Viscosity
86,000 cP
Specifications Recommended Substrates
Acrylonitrile-Butadiene-Styrene (ABS) | Aluminum | Cellulose Acetate Propionate (CAP) | Flame Retardant (FR-4) Board | Glass | Liquid Crystal Polymer (LCP) | Magnesium | Polycarbonate (PC) | Polyethylene Terephthalate (PET) | Polyphenylene Sulfide (PPS) | Polystyrene (PS) | Stainless Steel (SS)
Specifications Uncured Appearance
Off White Opaque to Charcoal Translucent Gel
Specifications Volumetric Shrinkage
1.1 %