Dymax Multi-Cure 11,000 cP Electronic Potting Adhesive

Name: Dymax Multi-Cure 11,000 cP Electronic Potting Adhesive
Brand: Dymax Corp.
SKU: ELE-523cfc
Price: 49.99 USD
Availability: OutOfStock

SKU:ELE-523cfc

Enhance electronic components with Dymax Multi-Cure 11,000 cP Adhesive featuring rapid UV curing and excellent adhesion.

$49.99

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The Dymax Multi-Cure 11,000 cP Nominal Viscosity Electronic Potting Adhesive is a high-performance solution designed for rapid curing upon UV/Visible light exposure. With the added flexibility of a secondary heat-cure or activator-cure function for shadow areas on PCBs, this adhesive creates translucent bonds with exceptional adhesion to various substrates. Ideal for connector, thermal switch, and sensor potting, as well as tamper-proofing applications, this adhesive offers a tack-free cure in 10-30 seconds.

Product Specifications

Applications 0

Potting | Sealing

Specifications Durometer Hardness

D75

Specifications Halogen Free

Yes

Specifications Nominal Viscosity

11,000 cP

Specifications Note For Ultraviolet Uv Cure Speed And Depth

UV cure speed depends on the intensity reaching the surface of the resin. Cure speed was measured at an intensity of 175 mW/cm2.

Specifications Recommended Substrates

Acrylonitrile Butadiene Styrene (ABS) | Filled Nylon | Glass (GL) | Metal

Specifications Ultraviolet Uv Cure Depth

6.4 mm | 0.25 in

Specifications Ultraviolet Uv Cure Speed

30 seconds

Dymax Multi-Cure 11,000 cP Electronic Potting Adhesive