Dymax Multi-Cure Electronic Encapsulant
Dymax Multi-Cure Electronic Encapsulant
SKU:ELE-ac19ed
Protect and insulate PCB components with Dymax Multi-Cure Electronic Encapsulant's fast-curing, low-stress formula.
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$29.99
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Dymax Multi-Cure Electronic Encapsulant
$29.99
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Dymax Multi-Cure Electronic Encapsulant
$29.99
Quantity: 1
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The Dymax Multi-Cure Electronic Encapsulant with a nominal viscosity of 400 cP provides complete protection for printed circuit board components and circuitry. Featuring UV/Visible light cure for rapid processing, this encapsulant cures tack-free in seconds, offering low stress under thermal cycling. Its secondary heat cure capability is ideal for shadow areas on PCBAs. With electrically insulating properties, this encapsulant is formulated without solvents and isocyanates, ensuring compliance with industry standards for environmental and electrical properties. Increase productivity and reduce costs with this resilient encapsulant that enhances adhesion to various substrates, making it suitable for chip-on-board, chip-on-flex, and multi-chip modules.
Product Specifications
Additional Information 0
Resilient Light-Curable Electronic Assembly/Circuit Board EncapsulantMulti-Cure® 9001-E-V3.0 is a performance grade with improved moisture and thermal cycle resistance and adhesion to various component substrates. Curing completely in as little as 5 seconds upon exposure to LED, longwave UV, and visible light, this material is environmentally resistant with good ionic and electrical properties. The encapsulant has a secondary heat cure for applications with shadow areas. This material displays excellent adhesion to PC boards and electronic components and is especially well-suited for chip-on-board, chip-on-flex, and multi-chip modules.Dymax® materials have no solvents added. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax® UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax® lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.
Features 0
UV/Visible light cure for fastest processingMulti-Cure - secondary heat cure for shadowed areasOne part formulation - no mixingLow Tg, low modulus for wire bondingNo solvents addedIsocyanate free
Recommended Substrates Recommended Substrates
Ceramic (CER) | Flex | Lead frame | Printed Circuit Boards (PCB) | Silicon
Specifications Cured Durometer Hardness
D45
Uncured Properties Nominal Viscosity
400 cP
Uncured Properties Uncured Appearance
Colorless Liquid