High-Performance 4,500 cP Electronic Encapsulant
High-Performance 4,500 cP Electronic Encapsulant
SKU:ELE-20c9bb
Rapidly cure and protect PCB components with our 4,500 cP Electronic Encapsulant. Halogen-free, UV/Visible cured, and high adhesion for potent applications.
Regular price
$39.99
Regular price
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$39.99
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High-Performance 4,500 cP Electronic Encapsulant
$39.99
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High-Performance 4,500 cP Electronic Encapsulant
$39.99
Quantity: 1
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Protect sensitive printed circuit board components with our high-performance 4,500 Centipoise Electronic Encapsulant. Featuring rapid UV cure in 15 seconds at 6.4mm depth, it ensures electrical insulation, low thermal stress, and high adhesion to substrates like ABS, FR-4, metal, PC, and PVC. This encapsulant is halogen-free, solvent-free, and available in flexible and rigid formulations for potting and sealing applications.
Product Specifications
Additional Key Features 0
Full UV/Visible cure in secondsNo solvent addedHigh adhesion to substratesFlexible and rigid products available
Applications 0
Potting | Sealing
Cured Mechanical Properties Durometer Hardness
D45
Recommended Substrates Recommended Substrates
Acrylonitrile Butadiene Styrene (ABS) | Flame Retardant (FR-4) | Metal | Polycarbonate (PC) | Polyvinyl chloride (PVC)
Specifications Halogen Free
Yes
Specifications Note For Ultraviolet Uv Cure Speed And Depth
UV cure speed depends on the intensity reaching the surface of the resin. Cure speed was measured at an intensity of 175 mW/cm2.
Specifications Ultraviolet Uv Cure Depth
6.4 mm | 0.25 in
Specifications Ultraviolet Uv Cure Speed
15 seconds
Uncured Properties Nominal Viscosity
4,500 cP