High-Purity 2.2 µm Spherical Silica Particles
High-Purity 2.2 µm Spherical Silica Particles
SKU:FIN-16034f
High-purity 2.2 µm silica particles for top-tier semiconductor encapsulation and coating needs.
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$29.99
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$29.99
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High-Purity 2.2 µm Spherical Silica Particles
$29.99
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High-Purity 2.2 µm Spherical Silica Particles
$29.99
Quantity: 1
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Our High-Purity 2.2 µm Spherical Silica Particles offer unmatched quality and reliability, ideal for semiconductor encapsulation and coating materials. With a D50 (Median Size) of 2.2 µm, a high purity of 99.0% Silicon Dioxide, and exceptional roundness of 0.98, these particles ensure high performance and consistency in various applications. Additionally, they boast high flowability, low thermal expansion, and electrical insulation properties, meeting the stringent standards of government and institutional procurement.
Product Specifications
Applications
Semiconductor encapsulation material fillerCoating materialsFiller material for various kinds of resin
Characteristics
High purity (non crystal silica)High sphericity (high roundness)High flowabilityHigh filling densityLow thermal expansion ratioElectrical insulation propertyLow water absorption property
Technical Specs Chemical Compound Aluminium Oxide Al2o3
10000 ppm
Technical Specs Chemical Compound Iron Iii Oxide Fe2o2
100 ppm
Technical Specs Chemical Compound Potassium Oxide K2o
50 ppm
Technical Specs Chemical Compound Silicon Dioxide Sio2
99.0 %
Technical Specs Chemical Compound Sodium Oxide Na2o
100 ppm
Technical Specs D50 Median Size
2.2 µm
Technical Specs Electric Conductivity
4.0 µs/cm
Technical Specs Ionic Impurity Free Cl
0.1 ppm
Technical Specs Ionic Impurity Free Na
0.8 ppm
Technical Specs Potential Of Hydrogen Ph
5.0
Technical Specs Roundness
0.98
Technical Specs Specific Gravity
2.21
Technical Specs Specific Surface Area
7.6 m²/g