High-Purity Fine Particle Spherical Silica (28.0 µm)
High-Purity Fine Particle Spherical Silica (28.0 µm)
SKU:FIN-54a517
Discover high-purity Fine Particle Spherical Silica with 28.0 µm median size for reliable semiconductor encapsulation and coating applications.
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$49.99
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$49.99
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High-Purity Fine Particle Spherical Silica (28.0 µm)
$49.99
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High-Purity Fine Particle Spherical Silica (28.0 µm)
$49.99
Quantity: 1
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Our high-purity Fine Particle Spherical Silica, with a median size of 28.0 µm, offers exceptional roundness, high flowability, and low thermal expansion. Ideal for semiconductor encapsulation and coating materials, it boasts 99.8% Silicon Dioxide purity and meets stringent industry standards for reliability and performance.
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Product Specifications
Applications
Semiconductor encapsulation material fillerCoating materialsFiller material for various kinds of resin
Characteristics
High purity (non crystal silica)High sphericity (high roundness)High flowabilityHigh filling densityLow thermal expansion ratioElectrical insulation propertyLow water absorption property
Technical Specs Chemical Compound Aluminium Oxide Al2o3
2000 ppm
Technical Specs Chemical Compound Iron Iii Oxide Fe2o2
20 ppm
Technical Specs Chemical Compound Potassium Oxide K2o
20 ppm
Technical Specs Chemical Compound Silicon Dioxide Sio2
99.8 %
Technical Specs Chemical Compound Sodium Oxide Na2o
20 ppm
Technical Specs D50 Median Size
28.0 µm
Technical Specs Electric Conductivity
2.0 µs/cm
Technical Specs Ionic Impurity Free Cl
0.1 ppm
Technical Specs Ionic Impurity Free Na
0.2 ppm
Technical Specs Potential Of Hydrogen Ph
5.5
Technical Specs Roundness
0.94
Technical Specs Specific Gravity
2.21
Technical Specs Specific Surface Area
0.7 m²/g