JCC GU22 Molded Frame 22x22mm Pitch Test & Burn-In Socket for BGA Devices
JCC GU22 Molded Frame 22x22mm Pitch Test & Burn-In Socket for BGA Devices
SKU:TES-d15426
Enhance BGA device testing with JCC GU22 Molded Frame 22x22mm Pitch Test & Burn-In Socket. Reliable and efficient for IC devices.
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$89.99
Regular price
Sale price
$89.99
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JCC GU22 Molded Frame 22x22mm Pitch Test & Burn-In Socket for BGA Devices
$89.99
Quantity: 1
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JCC GU22 Molded Frame 22x22mm Pitch Test & Burn-In Socket for BGA Devices
$89.99
Quantity: 1
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The JCC GU22 Molded Frame Series Test and Burn-In Socket are designed for efficient testing of Ball Grid Array (BGA) devices. With a precise 22x22mm pitch, this burn-in socket ensures secure connections for Integrated Circuit (IC) devices, enabling reliable testing and validation. Built for durability and accuracy, this socket streamlines the test process, saving time and ensuring consistent results. Compliant with Federal/DoD procurement standards and industry-specific certifications, it meets the rigorous requirements of institutional buyers.
Product Specifications
Specifications Pitch
22 x 22 mm | 0.87 x 0.87 in
Specifications Series
GU22 Molded Frame
Specifications Type
Burn-In Socket