JCC GU37 Molded Frame BGA Test & Burn-In Socket, 37x39mm Pitch
JCC GU37 Molded Frame BGA Test & Burn-In Socket, 37x39mm Pitch
SKU:TES-a64bd5
Reliable JCC GU37 Molded Frame BGA Test Socket for precise IC device testing & burn-in.
Regular price
$249.99
Regular price
Sale price
$249.99
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JCC GU37 Molded Frame BGA Test & Burn-In Socket, 37x39mm Pitch
$249.99
Quantity: 1
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JCC GU37 Molded Frame BGA Test & Burn-In Socket, 37x39mm Pitch
$249.99
Quantity: 1
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The JCC GU37 Molded Frame Series Test and Burn-In Socket is designed for advanced Ball Grid Array (BGA) devices. With a precise pitch of 37 x 39mm, this socket ensures secure connections for Integrated Circuit (IC) devices during testing and burn-in processes. The durable construction of the socket guarantees reliable performance and longevity, making it an ideal choice for both consumer electronics applications and stringent institutional testing environments. Compliant with Federal procurement standards and industry-specific certifications, this socket meets the highest quality and reliability requirements in the industry.
Product Specifications
Specifications Pitch
37 x 39 mm | 1.46 x 1.54 in
Specifications Series
GU37 Molded Frame
Specifications Type
Burn-In Socket