JCC GU78-BGA Molded Frame Test and Burn-In Socket - 78x116.7mm Pitch
JCC GU78-BGA Molded Frame Test and Burn-In Socket - 78x116.7mm Pitch
SKU:TES-88e1ce
Precisely test BGA devices with the JCC GU78-BGA Molded Frame Socket designed for secure IC connections during burn-in.
Regular price
$149.99
Regular price
Sale price
$149.99
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JCC GU78-BGA Molded Frame Test and Burn-In Socket - 78x116.7mm Pitch
$149.99
Quantity: 1
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JCC GU78-BGA Molded Frame Test and Burn-In Socket - 78x116.7mm Pitch
$149.99
Quantity: 1
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The JCC GU78-BGA Molded Frame Test and Burn-In Socket is designed for precise testing of Ball Grid Array (BGA) devices. With a pitch of 78 x 116.7 mm, this socket ensures secure connections for integrated circuit (IC) devices during burn-in. Its durable construction and accurate performance make it ideal for critical testing applications. Compliant with Federal/DoD procurement standards and industry certifications, this socket meets the highest quality and reliability requirements.
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Product Specifications
Specifications Pitch
78 x 116.7 mm | 3.07 x 4.59 in
Specifications Series
GU78-BGA Molded
Specifications Type
Burn-In Socket