JCC GU78-DIP Molded Frame Test Socket for DIP Devices
JCC GU78-DIP Molded Frame Test Socket for DIP Devices
SKU:TES-1e3b21
Reliable JCC GU78-DIP Molded Frame Test Socket for precise DIP device testing. Ensures quality results in a cost-effective manner.
Regular price
$149.99
Regular price
Sale price
$149.99
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JCC GU78-DIP Molded Frame Test Socket for DIP Devices
$149.99
Quantity: 1
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JCC GU78-DIP Molded Frame Test Socket for DIP Devices
$149.99
Quantity: 1
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The JCC GU78-DIP Molded Frame Test Socket is engineered for high reliability and cost competitiveness, making it ideal for testing and burn-in processes of Dual In-Line Package (DIP) devices. With a sturdy 78 x 116.6 mm size and a wide operating temperature range of -40 to 150 ºC, this socket ensures secure connections and accurate testing results, meeting the stringent demands of integrated circuit (IC) testing in both consumer electronics and institutional settings. Trust in JCC for exceptional quality and performance.
Product Specifications
Features
High reliabilityCost competitive
Specifications Series
GU78-DIP Molded Frame
Specifications Size
78 x 116.6 mm | 3.07 x 4.59 in
Specifications Temperature
-40 to 150 º