MetalBond 25K cP Adhesive
MetalBond 25K cP Adhesive
SKU:MET-e2a975
MetalBond 25K cP Adhesive - High-strength metal bonding solution with UV/Visible light cure, ideal for various substrates. Non-corrosive & moisture-resistant.
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$29.99
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MetalBond 25K cP Adhesive
$29.99
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MetalBond 25K cP Adhesive
$29.99
Quantity: 1
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MetalBond 25K cP Adhesive is a high-strength bonding solution ideal for metal and magnet applications. This adhesive cures with UV/Visible light, secondary heat, or activator, ensuring durable and clear bonds. With a nominal viscosity of 25,000 cP and a cured tensile strength of 28 MPa, it adheres well to various substrates like ceramic, glass, metals, and phenolic plastics. Perfect for DC motor assembly, coil winding, and more, this adhesive is non-corrosive, moisture-resistant, and non-flammable, making it suitable for harsh environments.
Product Specifications
Additional Information Additional Information
Structural Bonding Adhesive with Secondary Heat CureDymax® Multi-Cure® 6-621-GEL adhesive cures upon exposure to light and is designed for rapid assembling of parts made of metal, glass, ceramic, phenolic, filled polyamide, and other materials. Dymax® 6-621-GEL adhesive is specially formulated to cure with heat in applications where shadow areas exist. Typical applications include metal-to-glass bonding, coil winding, potting, structural battery bonding, and parts assembly.Dymax® materials have no solvents added. Their ability to cure in seconds enables faster processing, greater output, and lower processing costs. When cured with Dymax® light-curing spot lamps, focused-beam lamps, or flood lamps, they deliver optimum speed and performance for industrial product assembly. Dymax® lamps offer the ideal balance of UV and visible light for the fastest, deepest cures.
Features Features
Cures with UV/Visible lightSecondary heat cureActivator cureBonds multiple substratesHard and clear bondsNo solvents added
Specifications Cured Tensile At Break
28 MPa | 4,000 psi
Specifications Nominal Viscosity
25,000 cP
Specifications Recommended Substrates
Ceramic (CER) | Glass | Metals | Phenolic plastics | Polyamide (filled/unfilled)