Professional IC Package Extraction Tools
Professional IC Package Extraction Tools
SKU:TES-073b00
Efficiently extract PGA, SIP, and DIP IC packages with our professional tools. Vertical extraction for precision and durability.
Regular price
$89.99
Regular price
Sale price
$89.99
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Professional IC Package Extraction Tools
$89.99
Quantity: 1
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Professional IC Package Extraction Tools
$89.99
Quantity: 1
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Experience efficient IC package extraction with our professional-grade tools designed for PGA, SIP, and DIP type IC packages. Featuring a maximum contact resistance of 200 mΩ, dielectric strength of AC700 Vrms, and minimum insulation resistance of 100 MΩ, our tools ensure reliable performance. The vertical extraction mechanism prevents IC lead bending, making it ideal for applications requiring high extraction force. Enhance your productivity and precision with our user-friendly extraction tools.
Product Specifications
Features
Easy extraction of IC package from IC socket.Vertical extraction prevents IC leads bending.Suitable for need of high extraction force.
Specifications Dielectric Strength
AC700 Vrms (1 minute)
Specifications Maximum Contact Resistance
200 mΩ
Specifications Minimum Insulation Resistance
100 MΩ