Skin-Friendly Wearable Adhesive with UV/LED Cure - 32,000 cP
Skin-Friendly Wearable Adhesive with UV/LED Cure - 32,000 cP
SKU:CON-86ec11
Cutting-edge wearable adhesive for consumer electronics, skin-friendly, UV/LED cure, IBOA-free
Regular price
$24.99
Regular price
Sale price
$24.99
Unit price
per
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Experience superior bonding and flexibility with our 9200-W series wearable adhesive. Formulated without skin sensitizer IBOA, this product offers excellent weatherability and is ideal for assembling consumer wearable devices like AR/VR headsets and earbuds. UV/Visible light cure, one-part formulation, and moisture curing for shadow areas ensure easy application and durability. Providing electrical insulation and environmental protection, this adhesive meets top-quality standards for consumer electronics.
Product Specifications
Additional Information Additional Information
High-Viscosity IBOA-Free Electronic Encapsulant with UV Light & Moisture CureUV Light + moisture cure 9201-W electronic encapsulant is a next-generation product formulated without materials of concern such as IBOA (isobornyl acrylate), a known skin sensitizer. This encapsulant utilizes low-sensitizing ingredients, making it optimal for assembling end-user consumer wearable devices and electronics without compromising top quality or performance.9201-W is designed for applications such as encapsulating wire bonds, chip-on-board, or chip-on-flex circuits. This material provides electrical insulation, chemical, and environmental protection, as well as superior protection through reliability testing such as thermal shock, cycling, and vibration. Once applied to the board, the colorless electronic encapsulant is cured with UV/Visible light within seconds and features a secondary moisture cure for shadow areas.9201-W IBOA-free encapsulant is in full compliance.See our 2000-MW series of biocompatible IBOA- and TPO-free adhesives for medical wearables assembly.
Features Features
Free of IBOA (isobornyl acrylate), a known skin sensitizerSecondary moisture cure for shadow area curingCure using UV/Visible lightOne-part formulation - no mixingNo solvents added
Specifications Cured Durometer Hardness
D20 to D40
Specifications Cured Elongation At Break
178 %
Specifications Nominal Viscosity
32,000 cP
Specifications Recommended Substrates
Flame Retardant (FR-4) | Polyethylene Terephthalate (PET) | Polymide (PI)
Specifications Uncured Appearance
Colorless