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Thermally Conductive Silicone Adhesive Sealant – High Viscosity, 2.1 W/m·K

Thermally Conductive Silicone Adhesive Sealant – High Viscosity, 2.1 W/m·K

SKU:THE-a3599e

High-viscosity silicone adhesive sealant with exceptional thermal conductivity, self-bonding properties, and UL94V0 compliance.

Regular price $29.99
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Thermally Conductive Silicone Adhesive Sealant – High Viscosity, 2.1 W/m·K

Thermally Conductive Silicone Adhesive Sealant – High Viscosity, 2.1 W/m·K

$29.99

Quantity: 1

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Thermally Conductive Silicone Adhesive Sealant – High Viscosity, 2.1 W/m·K

Thermally Conductive Silicone Adhesive Sealant – High Viscosity, 2.1 W/m·K

$29.99

Quantity: 1

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Experience exceptional thermal conductivity with our 140000 Megapascal (Mpa) A Part Viscosity Thermally Conductive Silicone Adhesive Sealant. This gray paste adhesive by CHT cures at heat, meeting UL94V0 standards. With a tensile strength of 2.2 MPa and self-bonding properties, it ensures reliable adhesion. Its thermal conductivity of 2.1 W/m·K and dielectric strength over 18 kV/mm make it a premium choice for demanding industrial applications. Shelf life exceeds 12 months, offering lasting performance in a wide temperature range.

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Product Specifications

Features
UL94V0 approved file Number E334038Adhesion and 3mm cure through at 125ºC after only 10 minutesThermally conductiveShelf life = >12 months at <5ºC
Specifications Appearance
Gray Paste
Specifications A Part Viscosity
140000 MPa
Specifications Coefficient Of Thermal Expansion Cte Linear
195 ppm/ºC
Specifications Coefficient Of Thermal Expansion Cte Volumetric
586 ppm/ºC
Specifications Color
Gray
Specifications Cure Type
Addition
Specifications Dielectric Strength
>18 kV/mm
Specifications Durometer Shore A
56 duro
Specifications Elongation
105 %
Specifications Maximum Cure Time At 100 Degree Celsius C Tempera
16 minutes
Specifications Maximum Storage Temperature
<10 ºC
Specifications Minimum Storage Temperature
-5 ºC
Specifications Mixed Viscosity
140000 MPa
Specifications Non Corrosive
Yes
Specifications Pack Type
1 Part
Specifications Rheology
Paste
Specifications Room Temperature Vulcanizing Rtv Or Heat Cure
Heat Cured
Specifications Self Bonding
Yes
Specifications Sg
2.18
Specifications Tensile Strength
2.2 MPa
Specifications Test Conditions
After 1 hour at 125ºC
Specifications Thermal Conductivity
2.1 W/m·K
Specifications Underwriters Laboratories Ul 94v 0
Yes
Specifications Volume Resistivity
3.5E+13 Ω·cm
Specifications Youngs Modulus
0.752 MPa