Toagosei Aron DOX UV-Curable Resin
Toagosei Aron DOX UV-Curable Resin
SKU:ARO-8839a2
Explore the cutting-edge Toagosei Aron DOX UV-Curable Resin for high-performance coating & resin applications.
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Toagosei Aron DOX UV-Curable Resin is a high-purity, clear liquid resin with excellent diluency and cure promoting effects. With a molecular weight of 214.3 and >98% purity, it offers rapid polymerization, high cross-linking, and exceptional chemical and heat resistance properties. Specifically designed for ink & coating, adhesive, and resin formulation applications, this resin delivers low shrinkage, high gloss, and fast cure response, ensuring durability and performance in diverse settings.
Product Specifications
Additional Information
Aron oxetane is one of the series of UV-curable Resin that is manufactured by Toagosei, which holds world-leading technologies. We offer both radical curable resins and cationic curable resins to explore new possibilities of contributing to the energy and environmental fields of UV-curable Resins.Aron oxetane is the product name for Oxetane resin, which was first commercialized by Toagosei before any other company in the world. It is chiefly used in combination with epoxy resin as an additive for cationic curing which speeds up the curing of epoxy resins.These can be cured in an extremely short time, by just a few seconds of exposure to light (primarily UV light). Furthermore, because they can be used without solvents there is no need for a drying process. Thanks to superior characteristics including productivity improvement, energy savings, and low environmental impact, they are used in a variety of products found in everyday life, from inks and paints to data recording and electronics materials. Toagosei offers both radical curable resins and cationic curable resins to explore new possibilities of contributing to the energy and environmental fields of UV-curable Resins.
Applications Of Ultraviolet Uv Curable Resins
Ink & CoatingAdhesivesResin formulationSLA method 3D printing
Benefits Of Cationic System
Comparison to conventional radical cure systems, cationic systems have the following benefits.Low ShrinkageExcellent Adhesion to Substrates. High GlossLow Skin IrritationHigh Safety and ProcessibilityNo Oxygen InhibitionFast Cure even on Thin Film
Benefits Of Oxetane
Additionally, oxetane compounds have the following strong points as photo-cationic monomers, compared to conventional epoxy compounds.Rapid PolymerizationHigh Molecular Weight and Tough Film PropertiesCure Improvement by formulating with Epoxy CompoundsHigh Manufacturing Efficiency, Low Initiator Content neededNot MutagenicHigh SafetyNo Generation of-OHWater and Humidity Resistance, Excellent Electric PropertiesHigh Stability under High Temperature or Basic ConditionLong Shelf Life
Characteristics Of Aron Oxetane
High-speed curing of epoxy resinGenerally, epoxy resin has a quick initiation reaction but slow propagation reaction, and because it will only yield an oligomer with a molecular weight in the thousands of mass units, its physical properties can only be set to be hard and brittle. However, the polymerization of oxetane resins is slow to start: it will not happen immediately even when exposed to light, but only when the concentration of the initiator type exceeds a certain level and it produces a polymer with a molecular weight in the tens of thousands of mass units.When epoxy resin is combined with oxetane resin in such a way that makes the most of their respective characteristics, it is possible to cover their individual shortcomings. In other words, when epoxy resin with quick initiation is added to oxetane resin, the curing speed may be equivalent or superior to that of the cycloaliphatic epoxy used for light cationic polymerization. As the added epoxy increases, the molecular weight of the resulting polymer is slightly less than in the case of using oxetane resin alone, but it is sufficient as a high polymer and it is possible to design cured substances with extensibility and toughness.Because the reactivity of epoxy resin is not improved by mixing oxetane resin, it is necessary to mix in a large amount of oxetane resin when rapid curing is needed.Dark reaction (post polymerization)Cationic curable resin is characterized by the fact that polymerization progresses even after exposure to ultraviolet light. Normally, it takes four hours until cycloaliphatic epoxy resin is cured to exhibit solvent resistance. Oxetane resin is so reactive that post-curing is rapid. An appropriate type of resin produces adequate performance after nearly ten minutes of ultraviolet irradiation.Impact of the addition of small quantities on physical propertiesThe physical properties of cured products change after a small amount of oxetane resin is added. If the content of highly reactive oxetane resin is only 10–20%, Tg of the resin after ultraviolet curing rises by some 10°C. This is thought to reflect a rise in the system temperature caused by the reaction heat from the small volume of oxetane resin. Adding a small amount oxetane resin also increases breaking strength.AdhesivenessIn the majority of cases, adhesive strength declines after the addition of oxetane resin. It is so reactive that it produces a small hydroxyl group derived from the initiator and that reaction occurs in a short time. For these reasons, the stress caused by curing shrinkage is concentrated on the boundary surface. Especially if the adherend is made of plastic, it is necessary, for example, to reduce the curing speed or to blend a material with high wettability into the adherend. Effective methods of increasing adhesiveness include adding a high molecular weight resin or glycidyl ether epoxy resin to control the reaction speed and heated aging to eliminate internal stress.Mixing with glycidyl ether epoxy resinMonofunctional and bifunctional oxetane resins have very low viscosity and make it possible to blend a larger amount of high viscosity resin to extend the range of mixing formulas. In addition, with the high reactivity of oxetane resin, it is possible to blend glycidyl ether epoxy resin, such as bisphenol-A type and novolac type resin, or epoxy modified butadiene and other resins marketed as epoxy modified polymer. Normally such resins cannot be used for cationic polymerization because of their poor reactivity. This is one of the most effective blending solutions for producing adhesives and sealing agents. Storage stabilityFor most materials composed solely of epoxy resin, the molecular weight and perceived viscosity do not rise after a small amount of acid is generated from initiators with degradation over time. If oxetane resin is blended, high molecular weight polymer is generated to increase viscosity. In such cases, it is necessary to use a different initiator with higher stability or to add some stabilizer.Impact of moistureUltraviolet cationic curing is considered to be affected by moisture. In most cases, no marked reaction inhibition occurs when water is added to the mixture. However, atmospheric moisture has a significant impact. Generally, oxetane resin is more sensitive to water than epoxy resin, but it can be used in a stable state in any place where the atmospheric humidity can be controlled.
Note
We have been pursuing R&D of Oxetanes for many years and hold a wide-range of patent licenses. Please contact us before using oxetanes.
Technical Specs Abbreviated Name
DOX (Di Oxetanyl Ether)
Technical Specs Ames Test
Negative
Technical Specs Appearance
Clear Liquid
Technical Specs Benefits
High Cross-LinkHigh Cure Response
Technical Specs Boiling Temperature Per 5 Millimeter Of Mercury
119 ºC
Technical Specs Chemical Abstracts Service Cas Number
18934-00-4
Technical Specs Chemical Name
Bis(1-Ethyl(3-Oxelanyl))Methyl Ether
Technical Specs European Inventory Of Existing Chemical Substanc
Now Proceeding
Technical Specs Flash Point Temperature Open Cup
144 ºC
Technical Specs Melting Temperature
< -20 ºC
Technical Specs Molecular Weight
214.3
Technical Specs Primary Irritation Index Pii
1.0
Technical Specs Product Name
Aron Oxetane OXT-221 (DOX)
Technical Specs Purity
> 98 %
Technical Specs Specific Gravity At 25 Degree Celcius C Temperat
0.999
Technical Specs Toxic Substances Control Act Tsca Inventory
Now Proceeding
Technical Specs Viscosity At 25 Degree Celcius C Temperature
12.8 mPa·s