Ultrafine Spherical Silica Powder 27.0 µm D50
Ultrafine Spherical Silica Powder 27.0 µm D50
SKU:FIN-85acdd
High-purity Ultrafine Silica Powder for superior semiconductor encapsulation and coating applications.
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$39.99
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$39.99
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Ultrafine Spherical Silica Powder 27.0 µm D50
$39.99
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Ultrafine Spherical Silica Powder 27.0 µm D50
$39.99
Quantity: 1
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Our Ultrafine Spherical Silica Powder with a D50 of 27.0 µm offers exceptional purity (99.9% silicon dioxide) and high sphericity, perfect for semiconductors. With low impurities, high roundness, and superior electrical insulation properties, it meets rigorous industry standards for semiconductor encapsulation, coatings, and resin fillers.
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Product Specifications
Applications
Semiconductor encapsulation material fillerCoating materialsFiller material for various kinds of resin
Characteristics
High purity (non crystal silica)High sphericity (high roundness)High flowabilityHigh filling densityLow thermal expansion ratioElectrical insulation propertyLow water absorption property
Technical Specs Chemical Compound Aluminium Oxide Al2o3
500 ppm
Technical Specs Chemical Compound Iron Iii Oxide Fe2o2
20 ppm
Technical Specs Chemical Compound Potassium Oxide K2o
20 ppm
Technical Specs Chemical Compound Silicon Dioxide Sio2
99.9 %
Technical Specs Chemical Compound Sodium Oxide Na2o
20 ppm
Technical Specs D50 Median Size
27.0 µm
Technical Specs Electric Conductivity
2.0 µs/cm
Technical Specs Ionic Impurity Free Cl
0.1 ppm
Technical Specs Ionic Impurity Free Na
0.4 ppm
Technical Specs Potential Of Hydrogen Ph
5.5
Technical Specs Roundness
0.89
Technical Specs Specific Gravity
2.21
Technical Specs Specific Surface Area
1.6 m²/g