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UV Light Cure Electronic Encapsulant 18,000 cP

UV Light Cure Electronic Encapsulant 18,000 cP

SKU:ELE-dc5547

Protect PCB components with ease using our UV Light Cure Electronic Encapsulant. Dual-cure formulation for quick and durable results.

Regular price $39.99
Regular price Sale price $39.99
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UV Light Cure Electronic Encapsulant 18,000 cP

UV Light Cure Electronic Encapsulant 18,000 cP

$39.99

Quantity: 1

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UV Light Cure Electronic Encapsulant 18,000 cP

UV Light Cure Electronic Encapsulant 18,000 cP

$39.99

Quantity: 1

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The UV Light Cure Electronic Encapsulant with a nominal viscosity of 18,000 cP provides advanced protection for printed circuit board components. This dual-cure formulation cures rapidly with UV/Visible light and offers secondary moisture curing capability for shadow areas. It features low stress under thermal cycling, electrical insulation, and compatibility with various substrates. Ideal for applications like chip-on-board and wire bonding assembly, this room temperature stable encapsulant enhances durability and corrosion resistance, ensuring reliable performance. Increase manufacturing efficiency and reduce costs with this fast-curing and flexible solution.

Product Specifications

Additional Information 0
Room Temperature Stable Encapsulant & Wire Bond Adhesive with Secondary Moisture CureDual-cure 9014 encapsulant is formulated to cure primarily with UV light and includes a secondary moisture curing function for applications where shadow areas exist on printed circuit boards. Curing in seconds upon exposure to UV light energy, the product increases manufacturing efficiency because assembled parts can quickly move to the next step in production. This new formulation is also room-temperature stable, eliminating the need for cold shipping and storage.For manufacturers involved with chip-on-board, chip-on-flex, chip-on-glass, and wire bonding assembly, this material features excellent flexibility and increased durability and resistance on boards. 9014 also provides good moisture and corrosion protection of critical components found in electronic applications such as electric vehicle battery management systems.Dymax® materials have no solvents added and cure upon exposure to light. Their ability to cure in seconds allows for faster processing, greater output, and lower processing costs. When cured with Dymax® UV light curing spot lamps, focused beam lamps, flood lamps, or conveyor systems they deliver optimum speed and performance for maximum efficiency. Dymax® lamps offer the optimum balance of UV and visible light for the fastest, deepest cures.
Features 0
Cures with UV/Visible lightDual Cure - secondary moisture cure capabilityFluoresces blue under black lightsFlexible
Recommended Substrates Recommended Substrates
Flame Retardant (FR-4) | Glass | Kapton
Specifications Cured Linear Shrinkage
1.8 %
Uncured Properties Nominal Viscosity
18,000 cP
Uncured Properties Uncured Appearance
Light Yellow Translucent Gel